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Combination VacIon Plus Pumps/Titanium Sublimation Pumps

Combination VacIon Plus Pumps/Titanium Sublimation Pumps

The VacIon Plus Combination Pumps integrate titanium sublimation pumping to achieve ultra-high vacuum. The Titanium Sublimation Pump (TSP) creates extra high pumping speed for getterable gases while the ion pump handles the non-getterable gases such as argon and methane. The TSP can be added to the ion pump, or used as a separate pumping unit.

Combination Pump configurations are available for the VacIon Plus 150, 300, or 500, and include the cylindrical cryopanel, an extra side or bottom-mounted 8 inch ConFlat flanged port, and a TSP source mounted to the extra port providing extra high water pumping speed.

Agilent offers two types of titanium sublimation pumps: filament and titanium ball sources. Filament-type TSP sources can be turned off between sublimations and thereby avoid thermally-induced outgassing. The ball-type sources contain larger amounts of titanium for longer life when operated under conditions that use more titanium, such as higher operating pressures.

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