Managing the Transition to Lead-Free production

Objectives

To assure the transition to Lead-free soldering processes maintains customer and Agilent expectations for reliability and manufacturability of our products.

Additional Data Requests

• To avoid tin whisker growth on board mountable parts for solder, your company may be asked to complete a component finish questionnaire. Agilent evaluates component finishes to assure appropriate tin-whisker mitigation.

  • This complements and does not replace Agilent's Materials Declaration Requirements as described in the Environmental Compliance Framework

  • Requests are focused exclusively on board-mountable components 

Change Control

• All component changes, including those related to RoHS compliance must be submitted as early as possible to PCN@agilent.com for Agilent approval.

  • All product/component changes must be documented and reported per the requirements of EIA/JEDEC JESD46-C (Product Change Notification). All product/component discontinuances must be documented and reported per EIA/JEDEC JESD48-B (Product Discontinuance).

  • Any changes related to RoHS should be considered major changes.

  • Include technical details regarding the change, including reliability testing data and failure mitigation information that will assist Agilent with approving the change.

  • Include a timeframe for the change and the availability of legacy items.

  • Provide a copy of your PCN@agilent.com submittal to the contact that manages the procurement of material from you on behalf of Agilent.

Resolution of Discrepancies

• If you are a Contract Manufacturer and find a discrepancy between Agilent's AML and the suppliers MPN, please notify Agilent with a message sent to PCN@agilent.com . If you have a discrepancy that may result in a potential part shortage or put your next shipment(s) at risk, notify your Agilent contact immediately.

Additional Reliability Expectations

• Agilent is a participating sponsor of the iNEMI High Reliability Task Force which authored Recommendations to Electronics Industry Component Supply Base. These recommendations include:

  • continuing the supply of lead containing Ball Grid Array (BGA) components for high reliability applications;

  • adoption of iNEMI-recognized whisker mitigation practices; and,

  • testing and adherence to the qualification criteria of either the iNEMI Tin Whisker Acceptance Test Requirements (July 28, 2004) or the final agreement of the JEDEC JESD22A121 qualification criteria.

Contact Information

For questions about Agilent's restricted substances compliance and reporting expectations for suppliers, please ask your Agilent contact to refer you to a product environmental compliance expert for their business unit.

Requirements for Agilent's Direct Material Suppliers

• Environmental Compliance Framework
• Agilent General Specification for the Environment
• Agilent's Materials Declaration Requirements
• OEM WEEE Requirements