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Agilent has announced its latest limited access solution that does exactly this.
Cover-Extend technology is part of the Agilent Medalist VTEP v2.0 Powered test suite that brings to the fore-front your solution to counter test challenges today. Imagine the benefits of having test coverage on your PCBA without needing physical test access on each node. You'll be able to:
This new solution will draw its strength from two of the most well-known technologies in In-Circuit Testing - Boundary Scan and VTEP, which Agilent has 20 years of experience in.
What is VTEP v2.0 Powered?
Today's test challenges demand fast and reliable measurements. Not only that, it has to cater to limited access challenges, partly from ever-shrinking board geometries and increasingly higher on-board signals.
VTEP v2.0 Powered rises to the challenge providing test coverage without need of direct test access and with capability extending to ultra-low measurement IC pins (less than 5fF) and even power and ground pins which are crucial in High Speed Signal Propagation. It's your solution for coverage of integrated circuits, sockets, connectors and more in a limited-access environment.
VTEP v2.0 Powered is a suite of vectorless test solutions which is built upon the original Medalist VTEP technology and now enhanced with Cover-Extend technology following the inclusion of Network Parameter Measurement technology and the award-winning Medalist iVTEP. Bringing these solutions together into VTEP v2.0 Powered means having the best vectorless test in your hands.
VTEP v2.0 Powered test suite comprises :
VTEP
The core to Medalist VTEP v2.0 is the original Medalist VTEP engine.
The VTEP hardware is 4X more sensitive and up to 5X better in standard deviation than its predecessor, Testjet. The Autodebug function with per-pin-threshold characterization enables debugging in seconds.
iVTEP
This award-winning* focuses on ultra low value measurement of signal pins (< 5fF) of ICs. Targeting ultra small IC packages, flip chips and devices with minimal or no lead frame at all, iVTEP even works with ICs with non-grounded heatspreaders and heatsinks.
* Best in Test Award 2007, Test & Measurement World
Network Parameter Measurement technology
An industry first, Network Parameter Measurement* technology detects defects on power and ground pins. Currently available for connectors, this capability enables coverage that could otherwise escape even functional test.
* EM Asia Innovation Award, 2008
Benefits
Best-in-class coverage
Improved test stability
Decreased test-time-per-pin
Compatible with existing VTEP hardware
*Non-grounded
Cover-Extend
Latest technology in this suite enabling test coverage without test access.
Requirements
Hardware
VTEP hardware listed here :
VTEP Products
Description
Additional hardware needed to enable Cover-Extend capability.
Software
Medalist i3070 software ver.07.20p and above
New NPM Connector Library File Request
NPM requires a library file of the connector that user wants to test. To request for a library file for a new connector not currently in your ICT software, please click
here.
| Title/Description | Date | Type | |||
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Agilent Medalist VTEP v2.0 Powered, with Cover-Extend technology This brochure provides an overview of Cover-Extend under the VTEP v2.0 Powered vectorless test suite |
2008-04-21 | Brochure | ||
| Download the Introduction to Medalist VTEP v2.0 Powered with Cover-Extend technology |
2008-04-18 | Discussion Forum | |||
| Agilent Technologies' New Cover-Extend Technology Eliminates Need for Physical Test Points for ICT |
2008-03-20 | Press Materials | |||
| Agilent Technologies to Release Boundary Scan-VTEP Hybrid that Minimizes Obstacles to ICT |
2008-02-14 | Press Materials | |||
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Article reprint: Finding Power/Ground Defects on Connectors A New Approach This paper surveys existing tests for these defects and introduces a new solution based on Network Parameter Measurements |
2008-03-06 | Article Reprint | ||
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Maximising Test Coverage with Agilent Medalist VTEP v2.0 This paper describes how to get the most from Agilent Technologies’ industry-leading vectorless test innovation, the Medalist VTEP v2.0 which is a suite of solution comprising VTEP, iVTEP and NPM. |
2007-04-17 | Application Note | ||
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Agilent Vectorless Test EP (VTEP) Goes Head-to-Head with Agilent TestJet In beta tests, VTEP proved its abilities to improve in-circuit test coverage by over 80 percent compared to Agilent TestJet, especially on boards with hard-to-test packages such as BGAs, micro-BGAs, and SMT edge connectors. |
2003-12-16 | Success Story | ||
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Agilent Medalist iVTEP - intelligent Vectorless Test EP Building on the strength of TestJet and VTEP, Agilent intelligent Vectorless Test Extended Performance (iVTEP) can be used for ultra-small geometry packages, flip chips, as well as devices with minimal or no lead frames and heat spreaders. |
2006-04-04 | Technical Overview |