Printed Circuit Board Assembly Test & Inspection: AOI, AXI, ICT

Description

The Agilent Medalist Test and Inspection family covers the production line from end to end. Within this family you'll find breakthrough technologies for solder paste inspection (SPI), automated optical inspection (AOI), automated X-ray inspection (AXI) and in-circuit test (ICT), plus system software, common repair environments, process measurement tools, quality control tools and more; backed by Agilent's hallmark services, support and consulting.

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More Information

In-circuit Test
The Agilent Medalist In-Circuit Test (ICT) products provide users with ICT solutions that give them a significant return of investment with unparalleled test coverage and robustness.
Automated X-ray Inspection
Agilent’s Medalist Automated X-ray Inspection Systems deliver reduced conversion costs, reduced capital expenditure and high defect coverage to printed circuit board manufacturers.
Automated Optical Inspection
The paste, pre and post reflow Medalist Automated Optical Inspection systems feature Solid Shape Modeling, interchangeable lighting heads and Unified Platform architecture. It's the most flexible solution for defect detection and prevention.
Manufacturing Test Software Solutions
Integrated, cross-platform Medalist software tools accelerate the pcb assembly, test, and repair processes, reducing cost-per-assembly while helping you hit quality targets.
Uptime Support & Services
Professional, localized uptime support and end-to-end services that address real-world manufacturing challenges.
Lead-Free Test and Inspection
All Medalist test and inspection solutions are ready for lead-free manufacturing environments today.
Channel Partners and Solution Providers for Electronic Manufacturing
Agilent’s World-wide Channel Partner Program: View a list of system integrators, consultants, and test system providers experienced with Agilent instrumentation and products.