Automated Optical Inspection

Description

The Agilent Medalist SP50 Series 3 Solder Paste Inspection (SPI) system, Medalist SJ50 Series 3 and sj5000 Automated Optical Inspection system offer leading edge AOI technology such as next generation optics, low contrast component location, Solid Shape Modeling (SSM), and improved solder paste analysis algorithms. These capabilities help manufacturers deliver the highest coverage, speed, and flexibility in the AOI industry. The systems can also link to downstream repair stations with our Medalist Repair Tool and our Agilent Process Control Software to boost line yields while improving the process and board quality.

Read more about the defect coverage of Agilent AOI solutions.

To learn more, request additional product information.

** Pictures of the SJ and SP systems on our web pages do not represent a typical installation. Devices to limit access to the ports on either side of the equipment must be installed.

More Information

Assembled PCB Inspection: SJ Family
Offering the best AOI defect coverage and best resolution at the highest throughput. The SJ family is the most flexible AOI solution available today.
Solder Paste Inspection and Measurement: SP Family
Designed to provide 100% 3D solder paste inspection enabling the highest resolution at the fastest throughput in the industry.
Channel Partners and Solution Providers for Automated Optical Inspection
Agilent’s World-wide Channel Partner Program: View a list of system integrators, consultants, and test system providers experienced with Agilent instrumentation and products.